Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Forming a eutectic bond between a wafer having an anti-stiction coating and a cap wafer

Forming a eutectic bond between a wafer having an anti-stiction coating and a cap wafer

US Patent 10427929 · Granted Oct 1, 2019

Estimated economic value: $9,206,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Stress isolated device package and method of manufacture2024
Rough MEMS surface2018
Method for selective etching using dry film photoresist2018
Method for selective etching using dry film photoresist2018
Actively preventing charge induced leakage of semiconductor devices2017
Reducing MEMS stiction by deposition of nanoclusters2017
Etch release residue removal using anhydrous solution2017
Bonded wafer structure having cavities with low pressure and method for forming2017
Reducing MEMS stiction by increasing surface roughness2017
Reducing MEMS stiction by introduction of a carbon barrier2016
Method of making a MEMS die having a MEMS device on a suspended structure2016
Method of making a MEMS die having a MEMS device on a suspended structure2016