Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method to reduce pre-back-grinding process defects

System and method to reduce pre-back-grinding process defects

US Patent 8571699 · Granted Oct 29, 2013

Estimated economic value: $3,560,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package structure2025
3D integrated circuit (3DIC) structure2025
Integrated circuit package and method2025
Dielectric slots underneath conductive vias in interconnect structure of semicon2025
Integrated circuit package and method2025
Stacked memory cube with integrated thermal path for enhanced heat dissipation2025
Fingerprint sensor device and method2025
Semiconductor package and method2025
Semiconductor package system and method2025
Semiconductor package and manufacturing method thereof2025
IPD modules with flexible connection scheme in packaging2025
Methods of forming semiconductor packages2025