Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Power device packages having thermal electric modules using peltier effect and methods of fabricating the same

Power device packages having thermal electric modules using peltier effect and methods of fabricating the same

US Patent 8552541 · Granted Oct 8, 2013

Estimated economic value: $11,266,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multichip ray tracing device and method2025
Molded semiconductor package having a substrate with bevelled edge2023
Molded semiconductor package having a substrate with bevelled edge2023
Power module package2021
Semiconductor package2017
Semiconductor die package and method for making the same2015
Card-type information recording medium having embedded antenna for near field co2015
Power module having stacked flip-chip and method for fabricating the power modul2015
Card-type information recording medium having embedded antenna for near field co2015
Power device package comprising metal tab die attach paddle (DAP) and method of 2015
Power device package comprising metal tab die attach paddle (DAP) and method of 2015
Semiconductor package and method of fabricating the same2014