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Home › Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof

Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof

US Patent 8520391 · Granted Aug 27, 2013

Estimated economic value: $1,221,000 ⓘ

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