Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device with a plurality of mark through substrate vias

Semiconductor device with a plurality of mark through substrate vias

US Patent 8390129 · Granted Mar 5, 2013

Estimated economic value: $706,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sol-gel vaults and methods of making and using thereof2025
Semiconductor package and method of forming the same with dielectric layer dispo2025
Carbon nanodot-polyacrylic acid composite hydrogel, and method for preparing and2025
Heat sink and communication device2025
Semiconductor device package and method for manufacturing the same2025
Package process and package structure2025
Package process and package structure2025
Heat sink and communication device2025
Optical machine of smoke detector2025
Electronic device having a biometric input system including a composite cover el2024
Multimedia information processing method and apparatus, and storage medium2024
Semiconductor device package and method of manufacturing the same2024