Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin

Assignee

• Dainippon Ink And Chemicals

Inventors

• Ichiro Ogura (43 patents)
• Yoshiyuki Takahashi (85 patents)
• Kazuo Arita (25 patents)
• Kunihiro Morinaga (16 patents)
• Yutaka Satou (34 patents)

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