KA

Kazuo Arita

DI Dic: 20 patents #10 of 844Top 2%
DC Dainippon Ink And Chemicals: 5 patents #79 of 1,002Top 8%
Overall (All Time): #161,828 of 4,157,543Top 4%
25
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11760711 Epoxy compound, composition, cured product and laminate Masato Otsu, Etsuko Suzuki 2023-09-19
11685807 Resin composition, cured product, laminate, and electronic member Masato Otsu 2023-06-27
11117873 Oxazine compound, composition, and cured product Tomohiro Shimono, Masato Otsu, Junji Yamaguchi, Etsuko Suzuki 2021-09-14
11117872 Oxazine compound, composition and cured product Tomohiro Shimono, Junji Yamaguchi, Masato Otsu 2021-09-14
11104788 Composition, cured product and laminate Masato Otsu, Etsuko Suzuki, Junji Yamaguchi, Tomohiro Shimono 2021-08-31
11028059 Oxazine compound, composition and cured product Tomohiro Shimono, Junji Yamaguchi, Masato Otsu 2021-06-08
10981865 Substituted or unsubstituted allyl group-containing maleimide compound, production method therefor, and composition and cured product using said compound Junji Yamaguchi, Tomohiro Shimono, Masato Otsu 2021-04-20
10913725 Oxazine compound, composition and cured product Masato Otsu, Tomohiro Shimono, Junji Yamaguchi 2021-02-09
10577307 Methods for producing polycyclic aromatic aminophenol compound and resin composition, and polycyclic aromatic aminophenol compound, resin composition, and cured product Tomohiro Shimono, Junji Yamaguchi 2020-03-03
10399312 Oxazine compound, composition and cured product Masato Otsu, Tomohiro Shimono, Junji Yamaguchi 2019-09-03
10301471 Curable resin composition, cured product thereof, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, build-up film, build-up substrate, fiber-reinforced composite material, and fiber-reinforced resin molded product Tomohiro Shimono 2019-05-28
10059798 Active ester resin, epoxy resin composition, cured product thereof, prepreg, circuit board, and build-up film Tomohiro Shimono 2018-08-28
9963544 Active ester resin containing phosphorus atom, epoxy resin composition and cured product thereof, prepreg, circuit board, and build-up film Etsuko Suzuki 2018-05-08
9441069 Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin material Hajime Watanabe 2016-09-13
9217053 Active ester resin, thermosetting resin composition, cured product of same, semiconductor encapsulation material, prepreg, circuit board, and build-up film Etsuko Suzuki 2015-12-22
8791214 Active ester resin, method for producing the same, thermosetting resin composition, cured product of the thermosetting resin composition, semiconductor encapsulating material, pre-preg, circuit board, and build-up film Kan Takeuchi, Etsuko Suzuki, Kunihiro Morinaga 2014-07-29
8729192 Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating material Ichirou Ogura, Kunihiro Morinaga 2014-05-20
8669333 Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film Etsuko Suzuki 2014-03-11
8394911 Phenol resin composition, production method therefor, curable resin composition, cured product thereof, and printed circuit board Yutaka Satou, Ichirou Ogura 2013-03-12
8263714 Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin Ichiro Ogura, Yoshiyuki Takahashi, Kunihiro Morinaga, Yutaka Satou 2012-09-11
8168731 Curable resin composition, cured product thereof, printed wiring board, epoxy resin, and process for producing the same Yutaka Satou, Ichirou Ogura 2012-05-01
8084567 Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin Ichirou Ogura, Kunihiro Morinaga, Yutaka Sato 2011-12-27
7985822 Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin Ichiro Ogura, Yoshiyuki Takahashi, Kunihiro Morinaga, Yutaka Satou 2011-07-26
7718741 Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin Ichirou Ogura, Kunihiro Morinaga, Yutaka Sato 2010-05-18
6794478 Preparing epoxy resin by distilling two fractions to recover and reuse epihalohydrin without glycidol Ichiro Ogura 2004-09-21