KM

Kunihiro Morinaga

DI Dic: 12 patents #24 of 844Top 3%
DC Dainippon Ink And Chemicals: 4 patents #105 of 1,002Top 15%
Overall (All Time): #291,869 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11767424 Polyfunctional phenolic resin, polyfunctional epoxy resin, curable resin composition containing these, and cured product thereof Shinji Onda 2023-09-26
11286385 Epoxy resin composition, curable resin composition, and fiber-reinforced composite material Koji Hayashi, Nana Sugimoto 2022-03-29
11015019 Epoxy resin, production method, epoxy resin composition and cured product of same Yousuke Hirota, Shota Tanii, Koji Hayashi 2021-05-25
10982040 Epoxy resin, epoxy resin composition including same, and cured product using said epoxy resin composition Nana Sugimoto, Koji Hayashi 2021-04-20
10329231 Epoxy compound, method for producing the same, epoxy resin composition, and cured product thereof Yasuyo Yoshimoto, Hiroshi Kinoshita, Masamichi Hayashi 2019-06-25
10047190 Epoxy resin, method for producing epoxy resin, curable resin composition, cured product, fiber reinforced composite material, and molded article Makoto Kimura, Koji Hayashi, Takamitsu Nakamura 2018-08-14
10047256 Epoxy resin composition, cured product, heat radiating material, and electronic member Yasuyo Yoshimoto, Atsushi Oshio, Hiroshi Kinoshita, Daisuke Ito 2018-08-14
9975987 Epoxy resin, method for producing epoxy resin, curable resin composition and cured product thereof, fiber-reinforced composite material, and molded article Koji Hayashi, Makoto Kimura, Shigeki Matsui 2018-05-22
9765179 Method for producing biphenyl-skeleton-containing epoxy resin Yasuyo Yoshimoto, Hiroshi Kinoshita 2017-09-19
9738580 Epoxy compound, method for producing the same, epoxy resin composition, and cured product thereof Yasuyo Yoshimoto, Hiroshi Kinoshita, Masamichi Hayashi 2017-08-22
8791214 Active ester resin, method for producing the same, thermosetting resin composition, cured product of the thermosetting resin composition, semiconductor encapsulating material, pre-preg, circuit board, and build-up film Kan Takeuchi, Etsuko Suzuki, Kazuo Arita 2014-07-29
8729192 Epoxy resin composition, cured article thereof, novel epoxy resin, novel phenol resin and semiconductor-encapsulating material Kazuo Arita, Ichirou Ogura 2014-05-20
8263714 Epoxy resin composition, cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin, method for producing novel phenol resin, and method for producing novel epoxy resin Ichiro Ogura, Yoshiyuki Takahashi, Kazuo Arita, Yutaka Satou 2012-09-11
8084567 Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin Ichirou Ogura, Kazuo Arita, Yutaka Sato 2011-12-27
7985822 Epoxy resin composition,cured article thereof, semiconductor sealing material, novel phenol resin, novel epoxy resin,method for producing novel phenol resin, and method for producing novel epoxy resin Ichiro Ogura, Yoshiyuki Takahashi, Kazuo Arita, Yutaka Satou 2011-07-26
7718741 Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin Ichirou Ogura, Kazuo Arita, Yutaka Sato 2010-05-18