Issued Patents All Time
Showing 25 most recent of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12103376 | Automobile | Yoichi Yamamoto, Hiroki Yonekawa, Takuya Yamashita, Shinya Akizuki, Yuuji Okamoto +1 more | 2024-10-01 |
| 11901249 | Curable composition and cured product thereof | Kazuhisa Yamoto, Koji Hayashi | 2024-02-13 |
| 11873356 | Curable composition and cured product thereof | Kazuhisa Yamoto, Koji Hayashi | 2024-01-16 |
| 11548977 | Active ester resin and composition and cured product using the same | Kazuhisa Yamoto, Koji Hayashi | 2023-01-10 |
| 11407708 | Active ester compound and composition and cured product obtained using the same | Kazuhisa Yamoto | 2022-08-09 |
| 11348855 | Semiconductor component and power module | Yasuyuki Ooi | 2022-05-31 |
| 11322790 | Prismatic secondary battery | Hiroaki Egawa | 2022-05-03 |
| 11299448 | Active ester compound | Tatsuya Okamoto | 2022-04-12 |
| 11053384 | Curable composition and cured product thereof | Akito Kawasaki, Tatsuya Okamoto | 2021-07-06 |
| 10800914 | Active ester composition and cured product thereof | Akito Kawasaki, Tatsuya Okamoto, Kazuhisa Yamoto | 2020-10-13 |
| 10741464 | Active ester resin and cured product thereof | Tatsuya Okamoto, Akito Kawasaki | 2020-08-11 |
| 10615156 | Power module | Takeshi Anzai | 2020-04-07 |
| 10435382 | Epoxy compound, epoxy resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board | Ayumi Takahashi | 2019-10-08 |
| 10113028 | Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded article | Yousuke Hirota, Takamitsu Nakamura | 2018-10-30 |
| 10081585 | Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board | Ayumi Takahashi | 2018-09-25 |
| 10011676 | Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board | Ayumi Takahashi | 2018-07-03 |
| 9902798 | Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board | Ayumi Takahashi, Gensuke Akimoto | 2018-02-27 |
| 9890237 | Epoxy compound, epoxy resin, curable compound, cured product thereof, semiconductor sealing material, and printed circuit board | Ayumi Takahashi | 2018-02-13 |
| 9765173 | Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board | Ayumi Takahashi | 2017-09-19 |
| 9736926 | Epoxy resin, curable resin composition, cured product thereof, and printed circuit board | — | 2017-08-15 |
| 9580634 | Phenolic-hydroxyl-containing resin, epoxy resin, curable resin composition, substance obtained by curing same, and semiconductor sealant | Norio Nagae, Yousuke Hirota, Nobuya Nakamura | 2017-02-28 |
| 9125309 | Epoxy resin, curable resin composition and cured product thereof, and printed wiring board | — | 2015-09-01 |
| 9056990 | Phosphorus-atom-containing oligomer composition, curable resin composition, cured product thereof, and printed circuit board | Koji Hayashi, Takamitsu Nakamura | 2015-06-16 |
| 9045508 | Phosphorus-containing oligomer and method for producing the same, curable resin composition and cured product of the same, and printed wiring board | Koji Hayashi | 2015-06-02 |
| 8519065 | Epoxy compound, curable composition, and cured product thereof | — | 2013-08-27 |