Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for aligning wafer and alignment apparatus using the method

Method for aligning wafer and alignment apparatus using the method

US Patent 8149404 · Granted Apr 3, 2012

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus for combining printed circuit boards2021
Semiconductor package including semiconductor chip with through opening2015
In-line package apparatuses and methods2014
Printed circuit board having reliable bump interconnection structure, method of 2010
Method of forming a thin wafer stack for a wafer level package2009
Method for manufacturing semiconductor wafer2009
Wafer level chip stack method2007
Die attaching method of semiconductor chip using warpage prevention material2007
Protective tape removing apparatus and method of assembling semiconductor packag2006
In line system used in a semiconductor package assembling2006
Apparatus and method for wafer backside inspection2005
Semiconductor chip having a bonding window smaller than a wire ball1999