Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus and method for wafer backside inspection

Apparatus and method for wafer backside inspection

US Patent 6923077 · Granted Aug 2, 2005

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package including semiconductor chip with through opening2015
In-line package apparatuses and methods2014
Method for aligning wafer and alignment apparatus using the method2012
System-in-package module and mobile terminal having the same2010
Method of forming a thin wafer stack for a wafer level package2009
Method for manufacturing semiconductor wafer2009
Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabric2008
Apparatus for stacking semiconductor chips, method for manufacturing semiconduct2008
Method of fabricating printed circuit board having thin core layer2008
Rigid flexible printed circuit board and method of fabricating same2008
Semiconductor multi-chip package and fabrication method2007
Wafer level chip stack method2007