Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and apparatus for performing RLC modeling and extraction for three-dimensional integrated circuit (3D-IC) designs

Method and apparatus for performing RLC modeling and extraction for three-dimensional integrated circuit (3D-IC) designs

US Patent 8146032 · Granted Mar 27, 2012

Estimated economic value: $6,043,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods and apparatus for timed hardware delay for reductions in instruction fet2025
Gun light that is easy to replace with batteries2025
Integrated machine for automatic cutting, polishing, stacking and unloading of s2025
Lithographic hotspot detection using multiple machine learning kernels2022
Double-sided light-concentrating solar apparatus and system2022
Protective steel plate with excellent cold-bend processing performance and metho2021
Protective composite steel plate and method for manufacturing same2021
Highly corrosion-resistant, high strength, A1-containing weathering steel plate 2020
Light-concentrating solar system2020
Physical to virtual scheduling system and method2020
Determining ECO aggressor nets during incremental extraction2020
Driving apparatus and device fabrication method2019