{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Semiconductor wafer holder and electroplating system for plating a semiconductor wafer", "item": "https://www.patentleaderboard.com/patent/8075756"}]}
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Semiconductor wafer holder and electroplating system for plating a semiconductor wafer

US Patent 8075756 · Granted Dec 13, 2011

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