Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Warpage-compensating die paddle design for high thermal-mismatched package construction

Warpage-compensating die paddle design for high thermal-mismatched package construction

US Patent 8017445 · Granted Sep 13, 2011

Estimated economic value: $7,627,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fingerprint sensor packages2025
Semiconductor packaging identifier2016
Semiconductor packaging identifier2015
Multiple die paddle leadframe and semiconductor device package2013
Multiple die paddle leadframe and semiconductor device package2013
Integrated circuit package with electrically isolated leads2012
Flip-flop semiconductor device packaging using bent leadfingers2012
Integrated circuit package and packaging method2012
Flip-flop semiconductor device packaging using an interposer2011
Semiconductor device packaging using etched leadfingers2011
System for controlling the processing of an integrated circuit chip assembly lin2010
Integrated back-end integrated circuit manufacturing assembly2010