Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12190626 | Fingerprint sensor packages | Oleksandr Hoshtanar, Igor Kravets, Oleksandr Karpin | 2025-01-07 |
| 9263398 | Semiconductor packaging identifier | — | 2016-02-16 |
| 8999752 | Semiconductor packaging identifier | — | 2015-04-07 |
| 8436460 | Multiple die paddle leadframe and semiconductor device package | Carlo Gamboa | 2013-05-07 |
| 8318547 | Integrated circuit package with electrically isolated leads | Brett A. Spurlock, Carlo Melendez | 2012-11-27 |
| 8017445 | Warpage-compensating die paddle design for high thermal-mismatched package construction | Carlo Gamboa | 2011-09-13 |
| 7939371 | Flip-flop semiconductor device packaging using an interposer | — | 2011-05-10 |
| 7939372 | Semiconductor device packaging using etched leadfingers | — | 2011-05-10 |
| 7818085 | System for controlling the processing of an integrated circuit chip assembly line | — | 2010-10-19 |
| 7698015 | Integrated back-end integrated circuit manufacturing assembly | — | 2010-04-13 |
| 7608914 | Integrated circuit package with electrically isolated leads | Brett A. Spurlock, Carlo Gamboa | 2009-10-27 |
| 7391104 | Non-stick detection method and mechanism for array molded laminate packages | Vani Verma | 2008-06-24 |
| 7105377 | Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process | Vani Verma | 2006-09-12 |
| 7045387 | Method of performing back-end manufacturing of an integrated circuit device | Thurman J. Rodgers | 2006-05-16 |
| 7031791 | Method and system for a reject management protocol within a back-end integrated circuit manufacturing process | — | 2006-04-18 |
| 6931298 | Integrated back-end integrated circuit manufacturing assembly | — | 2005-08-16 |
| 6901984 | Method and system for controlling the processing of an integrated circuit chip assembly line using a central computer system and a common communication protocol | — | 2005-06-07 |
| 6853202 | Non-stick detection method and mechanism for array molded laminate packages | Vani Verma | 2005-02-08 |
| 6730545 | Method of performing back-end manufacturing of an integrated circuit device | Thurman J. Rodgers | 2004-05-04 |
| 6730532 | Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process | Vani Verma | 2004-05-04 |
| 6649447 | Methods for plastic injection molding, with particular applicability in facilitating use of high density lead frames | Dagmar Beyerlein | 2003-11-18 |
| 6576491 | Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame | Vani Verma, Anthony Odejar | 2003-06-10 |
| 6562272 | Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packages | Vani Verma, Annie X. Tan | 2003-05-13 |
| 6331728 | High reliability lead frame and packaging technology containing the same | Vani Verma, Anthony Odejar | 2001-12-18 |
| 6316821 | High density lead frames and methods for plastic injection molding | Dagmar Beyerlein | 2001-11-13 |