Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8436460 | Multiple die paddle leadframe and semiconductor device package | Bo Soon Chang | 2013-05-07 |
| 8283772 | Flip-flop semiconductor device packaging using bent leadfingers | — | 2012-10-09 |
| 8106489 | Integrated circuit package and packaging method | Salvador Padre | 2012-01-31 |
| 8017445 | Warpage-compensating die paddle design for high thermal-mismatched package construction | Bo Soon Chang | 2011-09-13 |
| 7608914 | Integrated circuit package with electrically isolated leads | Brett A. Spurlock, Bo Soon Chang | 2009-10-27 |