Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6576491 | Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame | Bo Soon Chang, Vani Verma | 2003-06-10 |
| 6331728 | High reliability lead frame and packaging technology containing the same | Bo Soon Chang, Vani Verma | 2001-12-18 |