Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flip-flop semiconductor device packaging using bent leadfingers

Flip-flop semiconductor device packaging using bent leadfingers

US Patent 8283772 · Granted Oct 9, 2012

Estimated economic value: $2,093,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multiple die paddle leadframe and semiconductor device package2013
Integrated circuit package and packaging method2012
Warpage-compensating die paddle design for high thermal-mismatched package const2011
Integrated circuit package with electrically isolated leads2009