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Home › CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive

CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive

US Patent 8002860 · Granted Aug 23, 2011

Estimated economic value: $94,000 ⓘ

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