Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Systems and methods for removing wafer edge residue and debris using a residue remover mechanism

Systems and methods for removing wafer edge residue and debris using a residue remover mechanism

US Patent 7998865 · Granted Aug 16, 2011

Estimated economic value: $6,208,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Email bot click detection2025
Integratead wet clean for bevel treatments2025
Cleaning method with in-line SPM processing2024
Surface cleaning with directed high pressure chemistry2024
Reduced semiconductor wafer bow and warpage2024
Cleaning system with in-line SPM processing2023
Split gate memory cell fabrication and system2022
Method for stripping one or more layers from a semiconductor wafer2021
Dopant anneal with stabilization step for IC with matched devices2021
Integrated circuit having chemically modified spacer surface2019
Method of fabricating semiconductors2018
Inner L-spacer for replacement gate flow2017