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Home › Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers

Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers

US Patent 7964506 · Granted Jun 21, 2011

Estimated economic value: $10,929,000 ⓘ

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