{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same", "item": "https://www.patentleaderboard.com/patent/7960800"}]}
Skip to content
Home› Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same