Patents per Year
Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8598035 | Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same | Michael D. Gruenhagen, Suku Kim, James J. Murphy, Eddy Tjhia, Chung-Lin Wu +1 more | 2013-12-03 | $2,305,000 |
| 7960800 | Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same | Michael D. Gruenhagen, Suku Kim, James J. Murphy, Eddy Tjhia, Chung-Lin Wu +1 more | 2011-06-14 | $5,687,000 |
| 7242076 | Packaged integrated circuit with MLP leadframe and method of making same | — | 2007-07-10 | $16,964,000 |