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Home › Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board

Prepreg for printed wiring board, metal foil clad laminate and printed wiring board, and, method for manufacturing multi-layer printed wiring board

US Patent 7947332 · Granted May 24, 2011

Estimated economic value: $150,000 ⓘ

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