Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Back end integrated WLCSP structure without aluminum pads

Back end integrated WLCSP structure without aluminum pads

US Patent 7863742 · Granted Jan 4, 2011

Estimated economic value: $8,395,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Encapsulation structure2025
Semiconductor device and method of fabricating the same2025
Ceiling fan infrared detection and control system2024
Semiconductor device and method forming the same2024
Brushless DC motor control system for ceiling fan2024
Package structure and method for manufacturing the same2024
Automated vehicle safety response methods and corresponding vehicle safety syste2023
Method of forming dice and structure of die2023
Reflectance measurement system and method thereof2023
Long-distance speed control system for brushless DC motor of fan2023
Automated vehicle safety response methods and corresponding vehicle safety syste2023
Method for manufacturing a semiconductor device including patterning a polymer l2023