{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "System and method for dressing a wafer polishing pad", "item": "https://www.patentleaderboard.com/patent/7846007"}]}

Home › System and method for dressing a wafer polishing pad

System and method for dressing a wafer polishing pad

US Patent 7846007 · Granted Dec 7, 2010

Estimated economic value: $13,138,000 ⓘ

Assignee

Memc Electronic Materials

Inventors

Mark Stinson (5 patents)
Madhavan S. Esayanur (2 patents)
Dennis Buese (5 patents)
Emanuele Corsi (7 patents)
Ezio Bovio (9 patents)
Antonio Maria Rinaldi (2 patents)
Larry Flannery (3 patents)

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