Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8796116 | Methods for reducing the metal content in the device layer of SOI structures and SOI structures produced by such methods | Alexis Grabbe | 2014-08-05 |
| 7846006 | Dressing a wafer polishing pad | Mark Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio +1 more | 2010-12-07 |
| 7846007 | System and method for dressing a wafer polishing pad | Mark Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio +1 more | 2010-12-07 |