Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor die with die pad pattern

Semiconductor die with die pad pattern

US Patent 7834466 · Granted Nov 16, 2010

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device with directing structure and method therefor2024
Package with support structure2019
Methods and devices with enhanced grounding and shielding for wire bond structur2019
Package to board interconnect structure with built-in reference plane structure2018
Substrate with routing2017
Wafer level packages and methods for producing wafer level packages having delam2016
Microelectronic packages having layered interconnect structures and methods for 2016
Packaged integrated circuit using wire bonds2014
Circuit device with at least partial packaging and method for forming2011
Automatic broiler for variable batch cooking2011
Automatic broiler for variable batch cooking2011
Methods and apparatus for a semiconductor device package with improved thermal p2011