Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Substrate with routing

Substrate with routing

US Patent 9748168 · Granted Aug 29, 2017

Estimated economic value: $16,079,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device with directing structure and method therefor2024
Methods and devices with enhanced grounding and shielding for wire bond structur2019
Package to board interconnect structure with built-in reference plane structure2018
Packaged integrated circuit using wire bonds2014
Circuit device with at least partial packaging and method for forming2011
Automatic broiler for variable batch cooking2011
Automatic broiler for variable batch cooking2011
Methods and apparatus for a semiconductor device package with improved thermal p2011
Semiconductor die with die pad pattern2010
Integrated circuit module with integrated passive device2010
Die positioning for packaged integrated circuits2010
Method of packaging semiconductor devices2009