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Home › Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas

Apparatus for plasma-enhanced physical vapor deposition of copper with RF source power applied through the workpiece with a lighter-than-copper carrier gas

US Patent 7820020 · Granted Oct 26, 2010

Estimated economic value: $13,462,000 ⓘ

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