Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Laser assisted chemical vapor deposition for backside die marking and structures formed thereby

Laser assisted chemical vapor deposition for backside die marking and structures formed thereby

US Patent 7807573 · Granted Oct 5, 2010

Estimated economic value: $13,644,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultra small molded module integrated with die by module-on-wafer assembly2024
Fine feature formation techniques for printed circuit boards2024
Stacked die cavity package2023
Electronic assembly that includes a bridge2023
Semiconductor package having wafer-level active die and external die mount2023
Stacked die cavity package2022
Warpage control for microelectronics packages2021
Fine feature formation techniques for printed circuit boards2021
Microelectronic structures having multiple microelectronic devices connected wit2021
Semiconductor package having wafer-level active die and external die mount2021
Microelectronic structures having multiple microelectronic devices connected wit2020
Ultra small molded module integrated with die by module-on-wafer assembly2020