Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electrical die contact structure and fabrication method

Electrical die contact structure and fabrication method

US Patent 7795126 · Granted Sep 14, 2010

Estimated economic value: $2,620,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wire bond wires for interference shielding2025
Semiconductor device package with thermal pad2024
Flip chip packaged devices with thermal pad2024
Wire bond wires for interference shielding2023
Wire bond wires for interference shielding2022
Bump bond structure for enhanced electromigration performance2022
Fan-out electronic device2022
Integrated circuit backside metallization2022
Copper passivation2021
Integrated circuit backside metallization2020
Bump bond structure for enhanced electromigration performance2020
Additive deposition low temperature curable magnetic interconnecting layer for p2020