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Home › Solid high aspect ratio via hole used for burn-in boards, wafer sort probe cards, and package test load boards with electronic circuitry

Solid high aspect ratio via hole used for burn-in boards, wafer sort probe cards, and package test load boards with electronic circuitry

US Patent 7750650 · Granted Jul 6, 2010

Estimated economic value: $3,903,000 ⓘ

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