Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of etching an organic low-k dielectric material

Method of etching an organic low-k dielectric material

US Patent 7585778 · Granted Sep 8, 2009

Estimated economic value: $12,578,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Optical module and projection apparatus2022
HDMI apparatus using optical communication2022
HDMI apparatus using optical communication2021
Charging-discharging module of energy storage unit and charging-discharging meth2020
Plasma etching carbonaceous layers with sulfur-based etchants2012
Plasma etch and photoresist strip process with intervening chamber de-fluorinati2007
BARC shaping for improved fabrication of dual damascene integrated circuit featu2006
System level in-situ integrated dielectric etch process particularly useful for 2005
Process for selectively etching dielectric layers2005
Selective etching of low-k dielectrics2005
Etch process for dielectric materials comprising oxidized organo silane material2004
Method of etching carbon-containing silicon oxide films2003