Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electrically conducting adhesives for via fill applications

Electrically conducting adhesives for via fill applications

US Patent 7467742 · Granted Dec 23, 2008

Estimated economic value: $10,467,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thermal interface material, an integrated circuit formed therewith, and a method2024
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer 2023
Handler bonding and debonding for semiconductor dies2022
IR assisted fan-out wafer level packaging using silicon handler2022
Forming wearable stacked strain gauge sensor for monitoring2021
Enhanced adhesive materials and processes for 3D applications2021
Handler bonding and debonding for semiconductor dies2021
Electronics miniaturization platform for medication verification and tracking2021
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer 2021
3D integration method using SOI substrates and structures produced thereby2020
3D integration method using SOI substrates and structures produced thereby2020
Enhanced adhesive materials and processes for 3D applications2020