Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of packaging semiconductor die without lead frame or substrate

Method of packaging semiconductor die without lead frame or substrate

US Patent 7432130 · Granted Oct 7, 2008

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Device package substrate structure and method therefor2025
Packaged semiconductor device assembly2024
Device package substrate structure and method therefor2023
Package with conductive underfill ground plane2022
Hybrid package2021
Method of fabricating embedded traces2021
Micro-selective sintering laser systems and methods thereof2020
Substrate dielectric crack prevention using interleaved metal plane2020
Substrate interconnections for packaged semiconductor device2018
Packaged semiconductor device having a lead frame and inner and outer leads and 2018
Laser sintered interconnections between die2018
Universal BGA substrate2017