Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same

Wafer level chip size packaged chip device with an N-shape junction inside and method of fabricating the same

US Patent 7394152 · Granted Jul 1, 2008

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Motion sensor2025
Motion sensor2025
Robot capable of identifying tunnels2025
Video splitting method and electronic device2025
Lighting control method and apparatus for color picking based on environment, de2025
Method and system for constructing bone model, medium and device2025
Stator structure and method for manufacturing stator structure2025
Connection device and connection method for detection of a tension member for an2025
System and method for cardiovascular risk prediction and computer readable mediu2025
Vehicle, voice control device and method2024
Vehicle, driving assistance device and method2024
Method for preparing hydrogen sulfide from sulfur dioxide by electrochemical red2024