Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

US Patent 7307775 · Granted Dec 11, 2007

Estimated economic value: $32,534,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Systems and devices for high-throughput sequencing with semiconductor-based dete2025
Multiple source-detector pair photoplethysmography (PPG) sensor2025
Integrated lidar image-sensor devices and systems and related methods of operati2025
Phase noise and methods of correction in multi-frequency mode lidar2025
Methods and devices for mixing in a microfluidic system2025
Biosensors for biological or chemical analysis and methods of manufacturing the 2024
High-resolution pseudo-random dots projector module for depth sensing2024
Image sensor structure2024
Illumination for fluorescence imaging using objective lens2024
Ring for optically measuring biometric data2024
Integrated ECG electrode and antenna radiator2024
Semiconductor-based biosensors for base calling2024