Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Large die package and method for the fabrication thereof

Large die package and method for the fabrication thereof

US Patent 7298026 · Granted Nov 20, 2007

Estimated economic value: $90,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device and method of forming embedded wafer level chip scale packa2025
Multi-dimensional printing method and apparatus2025
Semiconductor device and method of forming an optical semiconductor package with2025
Semiconductor device and method of forming an optical semiconductor package with2025
Reliable semiconductor packages2025
Reliable semiconductor packages2025
Reliable semiconductor packages2024
Reliable semiconductor packages2024
Reliable semiconductor packages2024
Reliable semiconductor packages2024
Multi-dimensional printing method and apparatus2024
Semiconductor device and method of making a wafer-level chip-scale package2024