Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High wireability microvia substrate

High wireability microvia substrate

US Patent 7279798 · Granted Oct 9, 2007

Estimated economic value: $10,326,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multi-layer embedded capacitance and resistance substrate core2012
High performance chip carrier substrate2011
High performance chip carrier substrate2011
Multi-layer embedded capacitance and resistance substrate core2010
Method of making multi-chip electronic package with reduced line skew2009
Method of making circuitized substrate with improved impedance control circuitry2009
Low moisture absorptive circuitized substrate with reduced thermal expansion, me2008
High performance chip carrier substrate2008
Method of making same low moisture absorptive circuitized substrave with reduced2008
Multi-chip electronic package with reduced line skew and circuitized substrate f2008
Circuitized substrate with improved impedance control circuitry, method of makin2007
High performance chip carrier substrate2007