Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flip chip package with reduced thermal stress

Flip chip package with reduced thermal stress

US Patent 7176555 · Granted Feb 13, 2007

Estimated economic value: $1,686,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Passivation scheme for pad openings and trenches2025
Heat dissipating features for laser drilling process2025
Image sensor and manufacturing method thereof2025
Low warpage high density trench capacitor2025
Image sensor and manufacturing method thereof2025
Semiconductor device package having metal thermal interface material2024
Semiconductor arrangement and method of making2024
Semiconductor device2024
Passivation scheme for pad openings and trenches2024
Semiconductor device2024
Semiconductor device package having metal thermal interface material and method 2023
Low warpage high density trench capacitor2023