Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System and method for in situ characterization and maintenance of polishing pad smoothness in chemical mechanical polishing

System and method for in situ characterization and maintenance of polishing pad smoothness in chemical mechanical polishing

US Patent 7153182 · Granted Dec 26, 2006

Estimated economic value: $17,356,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Autoclean for load locks in substrate processing systems2024
Halogen removal module and associated systems and methods2021
Crimp collar with nylon insert combination2019
Single barb hose tail2019
Multichannel thermocouple compensation for three dimensional temperature gradien2018
Symmetric RF return path liner2018
Systems and methods for quantifying particle performance in a substrate processi2016
Multichannel thermocouple compensation for three dimensional temperature gradien2016
Plasma confinement ring assembly for plasma processing chambers2015
Method of making a gas distribution member for a plasma processing chamber2014
Edge ring assembly for plasma etching chambers2014
High lifetime consumable silicon nitride-silicon dioxide plasma processing compo2014