Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic part, and electronic part mounting element and an process for manufacturing such the articles

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

US Patent 7151306 · Granted Dec 19, 2006

Estimated economic value: $412,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Image forming apparatus2023
Drive transmission apparatus and image forming apparatus2019
Electronic component assembly2016
Electrode structure and method for forming bump2014
IC current measuring apparatus and IC current measuring adapter2014
Semiconductor bonding structure body and manufacturing method of semiconductor b2014
Flip-chip mounting resin composition and bump forming resin composition2014
Module board2014
Method for connecting between substrates, flip-chip mounting structure, and conn2013
Bump forming method using self-assembling resin and a wall surface2012
Semiconductor device having semiconductor elements formed inside a resin film su2012
Flip chip mounting method and bump forming method2012