Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

US Patent 7135353 · Granted Nov 14, 2006

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package module2020
Spinal complex cage2020
Semiconductor package including semiconductor chip with through opening2015
Apparatus for mounting semiconductor chips on a circuit board2014
In-line package apparatuses and methods2014
System-in-package module and mobile terminal having the same2010
Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabric2008
Semiconductor package using flexible film and method of manufacturing the same2008
Apparatus for stacking semiconductor chips, method for manufacturing semiconduct2008
Apparatus for stacking semiconductor chips, method for manufacturing semiconduct2008
Apparatus for stacking semiconductor chips, method for manufacturing semiconduct2008
Apparatus for stacking semiconductor chips, method for manufacturing semiconduct2008