{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Semiconductor chip capable of implementing wire bonding over active circuits", "item": "https://www.patentleaderboard.com/patent/7071575"}]}
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Home › Semiconductor chip capable of implementing wire bonding over active circuits

Semiconductor chip capable of implementing wire bonding over active circuits

US Patent 7071575 · Granted Jul 4, 2006

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