Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for monitoring and profiling an integrated circuit die temperature

Method and system for monitoring and profiling an integrated circuit die temperature

US Patent 6996491 · Granted Feb 7, 2006

Estimated economic value: $4,907,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Priority queue sorting system and method with deterministic and bounded latency2022
Interposer with beyond reticle field conductor pads2017
Semiconductor chip with thermal interface tape2017
In-rush current limiting switch control2017
Power savings via selection of SRAM power source2016
Configurable delay circuit and method of clock buffering2016
Configurable delay circuit and method of clock buffering2015
Bit-flipping in memories2015
Identifying a wireless device of a target user for communication interception ba2015
Providing test coverage of integrated ECC logic en embedded memory2014
Error detection in high-speed asymmetric interfaces utilizing dedicated interfac2014
Fault tolerant scannable glitch latch2014