Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets

Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets

US Patent 6858102 · Granted Feb 22, 2005

Estimated economic value: $12,167,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of purifying target material for an EUV light source2022
Method and apparatus for purifying target material for EUV light source2019
Method for manufacturing SiC wafer fit for integration with power device manufac2018
Manufacturing design and processing methods and apparatus for sputtering targets2016
Method for manufacturing SiC wafer fit for integration with power device manufac2016
Corrosion resistant electrodes for laser chambers2016
Flat SiC semiconductor substrate2015
Flat SiC semiconductor substrate2015
Liquid-particle analysis of metal materials2011
Copper sputtering targets and methods of forming copper sputtering targets2010
Surface for reduced friction and wear and method of making the same2010
Physical vapor deposition target constructions2009