Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Copper sputtering targets and methods of forming copper sputtering targets

Copper sputtering targets and methods of forming copper sputtering targets

US Patent 7767043 · Granted Aug 3, 2010

Estimated economic value: $5,178,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

ECAE processing for high strength and high hardness aluminum alloys2025
ECAE processing for high strength and high hardness aluminum alloys2025
Profiled sputtering target and method of making the same2025
Sputter trap having a thin high purity coating layer and method of making the sa2024
ECAE processing for high strength and high hardness aluminum alloys2023
ECAE processing for high strength and high hardness aluminum alloys2023
Sputter trap having a thin high purity coating layer and method of making the sa2023
Large-grain tin sputtering target2022
Large-grain tin sputtering target2022
ECAE materials for high strength aluminum alloys2022
ECAE materials for high strength aluminum alloys2022
Frictionless forged aluminum alloy sputtering target with improved properties2022