Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10002760 | Method for manufacturing SiC wafer fit for integration with power device manufacturing technology | Darren Hansen, Mark Loboda, Ian Manning, Kevin Moeggenborg, Stephan Mueller +3 more | 2018-06-19 |
| 9279192 | Method for manufacturing SiC wafer fit for integration with power device manufacturing technology | Darren Hansen, Mark Loboda, Ian Manning, Kevin Moeggenborg, Stephan Mueller +3 more | 2016-03-08 |
| 9165779 | Flat SiC semiconductor substrate | Mark Loboda | 2015-10-20 |
| 9018639 | Flat SiC semiconductor substrate | Mark Loboda | 2015-04-28 |
| 6858102 | Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets | Janine Kardokus, Chi tse Wu, Jane Buehler | 2005-02-22 |
| 6849139 | Methods of forming copper-containing sputtering targets | Janine Kardokus, Chi tse Wu, Jane Buehler | 2005-02-01 |
| 6645427 | Copper sputtering target assembly and method of making same | Janine Kardokus, Chi tse Wu, Jane Buehler | 2003-11-11 |
| 6579479 | Methods of forming a plurality of spheres; and pluralities of spheres | Colin Edie, David B. Keno | 2003-06-17 |
| 6331234 | Copper sputtering target assembly and method of making same | Janine Kardokus, Chi tse Wu, Jane Buehler | 2001-12-18 |
| 6113761 | Copper sputtering target assembly and method of making same | Janine Kardokus, Chi tse Wu, Jane Buehler | 2000-09-05 |