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Home › Method of controlling zinc-doping in a copper-zinc alloy thin film electroplated on a copper surface and a semiconductor device thereby formed

Method of controlling zinc-doping in a copper-zinc alloy thin film electroplated on a copper surface and a semiconductor device thereby formed

US Patent 6811671 · Granted Nov 2, 2004

Estimated economic value: $2,431,000 ⓘ

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